A 08-LC-TT
Assmann WSW Components
CONN IC DIP SOCKET 8POS TIN
98883
-
0.18000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
A 14-LC-TT
Assmann WSW Components
CONN IC DIP SOCKET 14POS TIN
12091
-
0.22000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
A 16-LC-TT
Assmann WSW Components
CONN IC DIP SOCKET 16POS TIN
30373
-
0.25000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
A 18-LC-TT
Assmann WSW Components
CONN IC DIP SOCKET 18POS TIN
25045
-
0.27000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
A 20-LC-TT
Assmann WSW Components
CONN IC DIP SOCKET 20POS TIN
20626
-
0.29000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
ED281DT
On Shore Technology Inc.
CONN IC DIP SOCKET 28POS TIN
10053
-
0.33000
-
1
Tube
ED
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
ED40DT
On Shore Technology Inc.
CONN IC DIP SOCKET 40POS TIN
15719
-
0.47000
-
1
Tube
ED
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 110°C
4816-3000-CP
3M
CONN IC DIP SOCKET 16POS TIN
6313
-
0.48000
-
1
Tube
4800
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
AR 08 HZL-TT
Assmann WSW Components
CONN IC DIP SOCKET 8POS TIN
24799
-
0.50000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
A 40-LC-TT
Assmann WSW Components
CONN IC DIP SOCKET 40POS TIN
6728
-
0.51000
-
1
Tube
-
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
SA143000
On Shore Technology Inc.
CONN IC DIP SOCKET 14POS GOLD
9085
-
0.72000
-
1
Tube
SA
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
4828-3004-CP
3M
CONN IC DIP SOCKET 28POS TIN
14207
-
0.73000
-
1
Tube
4800
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
A-CCS-044-Z-SM
Assmann WSW Components
IC SOCKET PLCC 44POS TIN SMD
2300
-
0.73000
-
1
Tube
-
Active
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Surface Mount
-
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Polyamide (PA9T), Nylon 9T, Glass Filled
-40°C ~ 105°C
SA163000
On Shore Technology Inc.
CONN IC DIP SOCKET 16POS GOLD
2788
-
0.75000
-
1
Tube
SA
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
AR-06-HZL/01-TT
Assmann WSW Components
CONN IC DIP SOCKET 6POS GOLD
16910
-
0.79000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
AR 14 HZL-TT
Assmann WSW Components
CONN IC DIP SOCKET 14POS TIN
7901
-
0.79000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
AR16-HZL-TT
Assmann WSW Components
CONN IC DIP SOCKET 16POS TIN
6522
-
0.90000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
SA203000
On Shore Technology Inc.
CONN IC DIP SOCKET 20POS GOLD
6248
-
0.93000
-
1
Tube
SA
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
110-43-308-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
31674
-
0.97000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-93-308-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
3993
-
0.97000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
A-CCS-032-Z-SM
Assmann WSW Components
IC PLCC SOCKET 32POS TIN SMD
13074
-
0.98000
-
1
Tube
-
Active
PLCC
32 (4 x 8)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Surface Mount
-
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Phosphor Bronze
Polyamide (PA9T), Nylon 9T, Glass Filled
-40°C ~ 105°C
110-44-314-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS TIN
3954
-
0.98000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-99-314-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS TINLEAD
3371
-
0.98000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
AR 18 HZL-TT
Assmann WSW Components
CONN IC DIP SOCKET 18POS TIN
7013
-
0.99000
-
1
Tube
-
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
A-CCS-044-Z-T
Assmann WSW Components
CONN SOCKET PLCC 44POS TIN
29063
-
1.02000
-
1
Tube
-
Active
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
1050281001
Molex, LLC
CONN CAM SOCKET 32POS GOLD
2400
-
1.10228
-
800
Tape & Reel (TR)
105028
Active
Camera Socket
32 (4 x 8)
0.035" (0.90mm)
Gold
3µin (0.08µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.035" (0.90mm)
Nickel
50µin (1.27µm)
Copper Alloy
Thermoplastic
-
1050281001
Molex, LLC
CONN CAM SOCKET 32POS GOLD
2830
-
1.93000
-
1
Cut Tape (CT)
105028
Active
Camera Socket
32 (4 x 8)
0.035" (0.90mm)
Gold
3µin (0.08µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.035" (0.90mm)
Nickel
50µin (1.27µm)
Copper Alloy
Thermoplastic
-
1050281001
Molex, LLC
CONN CAM SOCKET 32POS GOLD
2830
-
Calculate
-
1
Digi-Reel®
105028
Active
Camera Socket
32 (4 x 8)
0.035" (0.90mm)
Gold
3µin (0.08µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.035" (0.90mm)
Nickel
50µin (1.27µm)
Copper Alloy
Thermoplastic
-
08-3518-10
Aries Electronics
CONN IC DIP SOCKET 8POS GOLD
9238
-
1.20000
-
1
Bulk
518
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
8432-11B1-RK-TP
3M
CONN SOCKET PLCC 32POS TIN
1695
-
1.40000
-
1
Tube
8400
Active
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
A-CCS-068-Z-T
Assmann WSW Components
CONN SOCKET PLCC 68POS TIN
4328
-
1.42000
-
1
Tube
-
Active
PLCC
68 (4 x 17)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
8432-21B1-RK-TP
3M
CONN SOCKET PLCC 32POS TIN
3046
-
1.43000
-
1
Tube
8400
Active
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
115-43-308-41-003000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
3505
-
1.44000
-
1
Tube
115
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
940-44-032-17-400000
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 32POS TIN
5477
-
1.46000
-
1
Tube
940
Active
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
AR 28 HZL-TT
Assmann WSW Components
CONN IC DIP SOCKET 28POS TIN
5721
-
1.47000
-
1
Tube
-
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
14-3518-10
Aries Electronics
CONN IC DIP SOCKET 14POS GOLD
2638
-
1.56000
-
1
Bulk
518
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
110-13-308-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
2080
-
1.58000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
8444-21B1-RK-TP
3M
CONN SOCKET PLCC 44POS TIN
2208
-
1.65000
-
1
Tube
8400
Active
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
160µin (4.06µm)
Copper Alloy
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
110-93-316-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
8146
-
1.66000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-43-316-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
3378
-
1.66000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-44-328-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS TIN
3748
-
1.68000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-44-628-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS TIN
2856
-
1.68000
-
1
Tube
110
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-99-328-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS TINLEAD
1201
-
1.68000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-44-424-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 24POS TIN
2555
-
1.69000
-
1
Tube
110
Active
DIP, 0.4" (10.16mm) Row Spacing
24 (2 x 12)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-43-314-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
3055
-
1.70000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-93-314-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
2642
-
1.70000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
940-44-044-17-400000
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 44POS TIN
5512
-
1.75000
-
1
Tube
940
Active
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150µin (3.81µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
940-44-044-24-000000
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 44POS TIN
3974
-
1.80000
-
1
Tube
940
Active
PLCC
44 (4 x 11)
0.100" (2.54mm)
Tin
150µin (3.81µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-43-318-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 18POS GOLD
2279
-
1.87000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
940-44-052-24-000000
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 52POS TIN
3952
-
1.89000
-
1
Tube
940
Active
PLCC
52 (4 x 13)
0.100" (2.54mm)
Tin
150µin (3.81µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
210-43-316-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
3102
-
1.92000
-
1
Tube
210
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-44-632-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 32POS TIN
2556
-
1.92000
-
1
Tube
110
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
940-44-068-24-000000
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 68POS TIN
5335
-
1.94000
-
1
Tube
940
Active
PLCC
68 (4 x 17)
0.100" (2.54mm)
Tin
150µin (3.81µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
20-3518-10
Aries Electronics
CONN IC DIP SOCKET 20POS GOLD
1419
-
1.95000
-
1
Bulk
518
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
115-43-314-41-003000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
1796
-
1.96000
-
1
Tube
115
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
917-43-104-41-001000
Mill-Max Manufacturing Corp.
CONN TRANSIST TO-5 4POS GOLD
2570
-
1.97000
-
1
Tube
917
Active
Transistor, TO-5
4 (Round)
-
Gold
30µin (0.76µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
-
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
917-43-104-41-005000
Mill-Max Manufacturing Corp.
CONN TRANSIST TO-5 4POS GOLD
2528
-
2.01000
-
1
Tube
917
Active
Transistor, TO-5
4 (Round)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
-
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
54020-44030LF
Amphenol FCI
CONN SOCKET PLCC 44POS TIN
7085
-
2.03000
-
1
Tube
-
Active
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
100µin (2.54µm)
Copper Alloy
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Tin
100µin (2.54µm)
Copper Alloy
Polyphenylene Sulfide (PPS)
-40°C ~ 105°C
110-93-320-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 20POS GOLD
4082
-
2.08000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-43-320-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 20POS GOLD
3736
-
2.08000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
AR 40 HZL-TT
Assmann WSW Components
CONN IC DIP SOCKET 40POS TIN
4370
-
2.10000
-
1
Tube
-
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
111-93-316-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
2175
-
2.19000
-
1
Tube
111
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
540-44-032-17-400000
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 32POS TIN
2023
-
2.21000
-
1
Tube
540
Active
PLCC
32 (2 x 7, 2 x 9)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
110-43-210-10-002000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 10POS GOLD
3598
-
2.25000
-
1
Tube
110
Active
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5), 8 Loaded
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
30µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
214-44-318-01-670800
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 18POS TIN
3275
-
2.32000
-
1
Tube
214
Active
DIP, 0.3" (7.62mm) Row Spacing
18 (2 x 9)
0.100" (2.54mm)
Tin
100µin (2.54µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-13-314-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
1462
-
2.37000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
940-44-084-24-000000
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 84POS TIN
3814
-
2.51000
-
1
Tube
940
Active
PLCC
84 (4 x 21)
0.100" (2.54mm)
Tin
150µin (3.81µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
A-CCS44-G
Assmann WSW Components
CONN SOCKET PLCC 44POS GOLD
1817
-
2.51000
-
1
Tube
-
Active
PLCC
44 (4 x 11)
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
110-13-316-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 16POS GOLD
5756
-
2.70000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
540-44-044-17-400000
Mill-Max Manufacturing Corp.
CONN SOCKET PLCC 44POS TIN
1626
-
2.81000
-
1
Tube
540
Active
PLCC
44 (4 x 11)
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Surface Mount
Closed Frame
Solder
0.050" (1.27mm)
Tin
150µin (3.81µm)
-
Polyphenylene Sulfide (PPS)
-
110-43-328-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
6349
-
2.91000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-43-628-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
5949
-
2.91000
-
1
Tube
110
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-93-628-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
2589
-
2.91000
-
1
Tube
110
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-93-328-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 28POS GOLD
2035
-
2.91000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
A-CCS68-G
Assmann WSW Components
CONN SOCKET PLCC 68POS GOLD
1280
-
2.96000
-
1
Tube
-
Active
PLCC
68 (4 x 17)
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Through Hole
Closed Frame
Solder
0.050" (1.27mm)
Gold
-
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-55°C ~ 105°C
110-43-632-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 32POS GOLD
1060
-
2.97000
-
1
Tube
110
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
210-43-632-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 32POS GOLD
1712
-
3.43000
-
1
Tube
210
Active
DIP, 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
40-6518-10
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
1700
-
3.57000
-
1
Bulk
518
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
110-43-640-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 40POS GOLD
2695
-
3.71000
-
1
Tube
110
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-93-640-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 40POS GOLD
1133
-
3.71000
-
1
Tube
110
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
25-0513-10
Aries Electronics
CONN SOCKET SIP 25POS GOLD
552
-
4.15000
-
1
Bulk
0513
Active
SIP
25 (1 x 25)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
-
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
40-0518-10
Aries Electronics
CONN SOCKET SIP 40POS GOLD
2147
-
4.23000
-
1
Bulk
518
Active
SIP
40 (1 x 40)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
210-43-640-41-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 40POS GOLD
2349
-
4.29000
-
1
Tube
210
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1-1571994-0
TE Connectivity AMP Connectors
CONN SOCKET SIP 10POS GOLD
1400
-
4.79000
-
1
Bulk
510
Active
SIP
10 (1 x 10)
0.100" (2.54mm)
Gold
20µin (0.51µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
20µin (0.51µm)
Copper
Thermoplastic, Polyester
-
110-43-320-41-801000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 20POS GOLD
1589
-
5.02000
-
1
Tube
110
Active
DIP, 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
299-93-312-11-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 12POS GOLD
1326
-
5.19000
-
1
Tube
299
Active
DIP, 0.3" (7.62mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
299-43-312-10-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 12POS GOLD
366
-
5.79000
-
1
Tube
299
Active
DIP, 0.3" (7.62mm) Row Spacing
12 (2 x 6)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
299-93-314-10-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
810
-
5.92000
-
1
Tube
299
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
40-0518-11
Aries Electronics
CONN SOCKET SIP 40POS GOLD
440
-
6.15000
-
1
Bulk
518
Active
SIP
40 (1 x 40)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10µin (0.25µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-
20-0511-10
Aries Electronics
CONN SOCKET SIP 20POS TIN
2378
-
6.21000
-
1
Bulk
511
Active
SIP
20 (1 x 20)
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Through Hole
-
Solder
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
117-93-642-41-005000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 42POS GOLD
1366
-
6.61000
-
1
Tube
117
Active
DIP, 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.070" (1.78mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.070" (1.78mm)
Tin-Lead
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
299-43-314-10-001000
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 14POS GOLD
2822
-
6.70000
-
1
Tube
299
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole, Right Angle, Horizontal
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
10-2810-90T
Aries Electronics
CONN IC DIP SOCKET 10POS TIN
5318
-
7.88000
-
1
Bulk
Vertisockets™ 800
Active
DIP, 0.2" (5.08mm) Row Spacing
10 (2 x 5)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
40-C182-10
Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
486
-
8.19000
-
1
Bulk
EJECT-A-DIP™
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Brass
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
14-810-90R
Aries Electronics
CONN IC DIP SOCKET 14POS TIN
866
-
8.28000
-
1
Bulk
Vertisockets™ 800
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Through Hole, Right Angle, Vertical
Closed Frame
Solder
0.100" (2.54mm)
Tin
50µin (1.27µm)
Phosphor Bronze
Polyamide (PA46), Nylon 4/6
-
28-526-10
Aries Electronics
CONN IC DIP SOCKET ZIF 28POS TIN
2500
-
10.47000
-
1
Bulk
Lo-PRO®file, 526
Active
DIP, ZIF (ZIP)
28 (2 x 14)
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
10µin (0.25µm)
Beryllium Copper
Polyamide (PA46), Nylon 4/6, Glass Filled
-55°C ~ 105°C
TDU03DTOD
Sullins Connector Solutions
CONN SOCKET TRANSIST 3POS GOLD
153
-
10.56000
-
1
Bulk
-
Active
Transistor
3 (Rectangular)
-
Gold
30µin (0.76µm)
Beryllium Copper
Through Hole
Board Guide, Flange
Solder
-
Gold
30µin (0.76µm)
Beryllium Copper
Polyphenylene Sulfide (PPS)
-55°C ~ 175°C
28-6554-10
Aries Electronics
CONN IC DIP SOCKET ZIF 28POS TIN
212
-
10.96000
-
1
Bulk
55
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
32-6554-10
Aries Electronics
CONN IC DIP SOCKET ZIF 32POS TIN
808
-
12.22000
-
1
Bulk
55
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
40-6554-10
Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
217
-
14.58000
-
1
Bulk
55
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
